半導後前段製程設備介紹(S1115141)
Course Period：Now ~ Any Time
LINE sharing feature only supports mobile devices
Course Intro
Course Plan
http://www.lhu.edu.tw/class_intro/CH/CH81054.htm
-
20250224
-
20250303
-
ic封裝型式各參考圖表
-
1608245841 packaging equipment
-
Handbook of IC equipment packaging
-
20250310-1
-
20250317-1
-
20250224-1 PDF
-
20250303-1 PDF
-
20250310-1 PDF
-
20250317-1 PDF
-
20250324-1 PDF
-
20250331-1 PDF
-
20250407-1 PDF
-
20250407 先進微電子構裝 五南 chap1
-
20250407 先進微電子構裝 五南 chap2
-
20250407 先進微電子構裝 五南 chap4
-
20250421-1 PDF
-
20250428-1 PDF
-
20250505-1 PDF
-
20250505 先進封裝製程 五南 chap 12
-
20250505 先進封裝製程 五南 chap 13
-
20250505 先進封裝製程 五南 chap 14
-
20250512-1 PDF
-
20250512 成大 SEM 掃描式電子顯微鏡 訓練手冊
-
20250519 成大 TEM 穿透式電子顯微鏡 訓練手冊
-
20250519-1 PDF
-
20250526-1 PDF
-
20250602-1 PDF
-
20250609-1 PDF
Teacher / 楊子賢
Related Courses
|
|
||||||
|
|
|
||||||
|
|
|
||||||
|
|
|
||||||
|